The Chuck Yuska Scholarship is a prestigious opportunity established in honor of Mr. Chuck Yuska, the former President & CEO of PMMI (The Association for Packaging and Processing Technologies) for 28 years. This scholarship reflects Mr. Yuska's significant contributions to the growth of PMMI and the packaging industry, particularly through innovations showcased in the PACK EXPO trade show.
• Currently attending a North American college or university
• Academic Achievement: GPA of 3.0 or higher
• Area of Study: Engineering, packaging, processing, mechatronics, or a related field
This scholarship serves as a recognition of excellence in academic pursuits, particularly in fields that contribute to the advancement of packaging and engineering. Students who meet the criteria are encouraged to apply and continue the legacy of innovation in the packaging industry. The Chuck Yuska Scholarship aims to support and empower the next generation of leaders in these critical fields, fostering ongoing progress and creativity.