Dedicated to nurturing talent in the dynamic fields of engineering, packaging, processing, and mechatronics, the PACK EXPO Scholarship awards six outstanding students attending a North American college or university with $5,000 each.
Eligibility Criteria:
• Currently enrolled at a North American college or university.
• Pursuing studies in Engineering, Packaging, Processing, Mechatronics, or a related field.
• Academic Achievement: Maintain a GPA of 3.0 or higher.
This scholarship is a testament to the commitment to excellence and innovation in the realms of engineering and packaging. By providing financial support to deserving students, the scholarship aims to empower the next generation of professionals who will contribute significantly to these dynamic and evolving fields. The winners will be celebrated at the prestigious PACK gives BACK event at PACK EXPO, reinforcing the industry's dedication to fostering talent and pushing the boundaries of what's possible in engineering and packaging.
