One scholarship is available to an undergraduate student in their sophomore and junior years, who is studying subjects in relation to synthesis and processing, structure, properties, and performance of electronic, photonic, magnetic, and superconducting materials as well as materials used in packaging, and interconnecting such materials in device structures. An additional $500 for travel expenses is available to the recipient in order to personally accept the award at the TMS Annual Meeting and Exhibition.
-The applicant must be a student member of Material Advantage
-Applicants must be enrolled full-time in a metallurgical/materials science engineering program at a qualified college/university
-Applicants must be undergraduate sophomores or junior unless otherwise noted
-Relatives of members of the funding committee/division are not eligible
-Submitted coursework must be relevant to the scholarship for which the student is applying
For more information or to apply, please visit the scholarship provider's website.