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Packaging Engineer Scholarship

$2,000

November 02, 2021

Awards Available: 1

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  • Scholarship Description
  • Packaging Compliance Labs is offering a scholarship for packaging engineers for Winter 2021. The winner will be awarded a $2,000 scholarship towards their packaging engineering education. This scholarship is available for packaging engineering college students who are enrolled in any college/university with a packaging engineering program.
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  • Contact
  • Ryan Erickson
  • 4334 Brockton Drive SE Suite E
  • Kentwood, MI 49512
  • 616-227-2745
  • Learn More

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